Product Description of Epoxy Resin CAS#24969-06-0
Epoxy resin is a kind of high molecular weight polymer containing epoxy groups in its molecular structure. It commonly appears as transparent viscous liquid or solid resin pellets. It can cross link with various curing agents to form cured products. The cured material delivers outstanding bonding strength, chemical resistance and insulation performance. It is an important basic polymer raw material for coatings, composite materials, electronics and electrical industries.
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Chemical Properties of Epoxy Resin CAS#24969-06-0
| Melting point | 115-120 °C |
| density | 1.36 g/mL at 25 °C(lit.) |
| Tg | -22 |
| Fp | 252 °C |
| form | slab/chunk |
| Dielectric constant | 2.5（Ambient） |
| InChI | InChI=1S/C3H5ClO/c4-1-3-2-5-3/h3H,1-2H2 |
| InChIKey | BRLQWZUYTZBJKN-UHFFFAOYSA-N |
| SMILES | C(C1OC1)Cl |
| EPA Substance Registry System | Oxirane, (chloromethyl)-, homopolymer (24969-06-0) |
Safety Information
| Hazard Codes | Xi,N |
| Risk Statements | 36/38-43-51/53 |
| Safety Statements | 24/25-61-37/39-28 |
| RIDADR | UN 3082 9/PG 3 |
| WGK Germany | 3 |
| RTECS | KC2100000 |
| TSCA | TSCA listed |
| HS Code | 39072090 |
| Storage Class | 11 - Combustible Solids |
| Toxicity | LD50 oral in rat: 1200mg/kg |
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Product Application of Epoxy Resin CAS#24969-06-0
Widely used as anti corrosion coating, structural adhesive, electronic potting compound and matrix resin for composite materials. It is largely applied in industrial anti-corrosion painting, component bonding & sealing, insulation encapsulation for electronic parts, floor materials, as well as carbon-fiber composite materials and mold casting manufacturing sectors.
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